COIN612/R
WLP+ASIC Uncooled thermal camera module
COIN series uncooled thermal imaging camera core integrates the wafer-level package detector produced by GST, ASIC chip for imaging processing, micro-motion electromagnetic threshold shutter and general optical interface. It is beneficial to OEM customers for secondary development and suitable for the development and integration of thermal imager in various applications.
640x512IR resolution
12μmPixel Pitch
＜3s Start-up Time
＜40mKNETD
COIN612 integrates 640×512@12μm wafer level package (WLP) infrared thermal detector, high performance signal processing circuit and image processing algorithm.
The COIN612 infrared thermal camera core features in sharp and crisp image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
Its lightweight and flexible features with various industry standard interfaces make it beneficial to OEM customers for secondary development and integration in all kinds of infrared thermal cameras.
Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It’s easier for COIN series to be integrated into more terminal products and greatly reduces the cost for customers.
Technical Parameters
Model
COIN612/R
ADD TO COMPARE
IR Detector Performance
Resolution
640X512@12μm
Spectral response
8~14μm
NETD
＜40mk
Image Processing
Frame rate
9Hz/25Hz/30Hz/50Hz/60Hz
Start-up time
＜3秒
Analog video
PAL/NTSC
Digital video
Y16/YUV/BT656
Dimming
Linear/Histogram/Mixed three modes
Digital zoom
1~8X continual zoom，step size 1/8
Image display
Black hot/White hot/Pseudo color
Image direction
Horizontally/Vertically/Diagonally Flip
Image algorithm
NUC，AGC，IDE，DNR
Image Display Performance
Communication mode
RS232-TTL, 115200bps
Supply voltage
3.5~5.5V
Typical power consumpti
<0.75W
External Cable Connection
Standard external interface
50pin_HRS interface
Operating temperature range
-10℃~50℃
Temperature range
-20℃~150℃，100℃~550℃
Temperature accuracy
±3℃ or ±3%
Sdk
ARM/Windows SDK，full screen thermograph
Physical Characteristic
Dimension(mm)
25.4×25.4×14.1（Including shutter）
Weight
机芯：13g±0.5g（Including shutter）
Operation temperature
-40°C~+70°C
Storage temperature
-45°C~+85°C
Humidity
5%~95%，non-condensing
Vibration
Random Vibration 5.35grms，3 axis
Shock
Half-sine wave，40g/11ms，3 axis 6 directi
Optics
Optional lens
Fixed focus athermal：8.8mm/13mm/19mm
* All specifications are subject to the actual product. Guide sensmart reserves the right to change the technical specifications without notice or liability to you.
