Dicing Blades With Hub

 

Our diamond blade with Hub is with a stronger edge, which makes the blade more rigid and keeps the edge not to be broken, so the cutting with the blade is in high efficiency and of excellent quality. This wheel is mainly used for the cutting and dicing wafers of silicon, GaAs, gap, pzt, etc.

 

Specifications of Dicing Blades With Hub

 

Product Specification

Available shape

14A1

Working Condition

Grinding Type

Wet