Planar Metal Sputtering Targets
Planar Metal Sputtering Targets
Excellent properties such as high purity, high density, high thermal conductivity, high stability, uniform grain, etc.
High purity: The metal target requires very high purity, to ensure the stability and reliability of the material.We have various purity levels to suit your specific requirements, with the minimum purity of 99.5% up to 99.9999% for some metals. Also have controlled specific impurities within the target
High density: Metal targets have high density characteristics, usually up to 99%, to ensure the stability and quality of materials.
Uniform grain: Controlled grain size and direction
Good composition uniformity: the component distribution is uniform, ensure the film formation rate is uniform, film quality.
Manufacturing processes
Manufacturing processes depend on the properties of the target material and its application.
We have (Vacuum melting, Rolling, Vacuum spraying, Atmospheric spraying, Vacuum hot pressing, Hot Isostatic Pressing (HIP), Cold Isostatic Pressing +Various atmosphere sintering technology, Low temperature metal, Vacuum hot pressing sintering technology, Electron beam melting, Zone melting purification, Vacuum directional solidification technology, etc).
For metal and alloy target, we adopt Vacuum melting, Rolling, Low temperature metal,Vacuum hot pressing sintering, Electron beam melting, Zone melting purification, Vacuum directional solidification technology.
Both Planar and Rotary target available
Planar target
Planar targets mainly refer to circular targets and rectangular targets with certain thickness. The plane target material is connected with sputtering equipment by means of thread, the sputtering film layer is attached to the substrate under vacuum conditions, and then the film is processed by various methods to meet different needs.
Rotary targetRotary target is a magnetically controlled target. The target is shaped like a cylinder containing a stationary magnet for rotation. Its advantage is high utilization rate, the disadvantage is high cost.
Reference size
* Maximum sizes of planar target
Thickness: 30mm (can be 60mm for round target)
Width: max 2000mm
Length: max 4000mm
* Maximum sizes of rotary target
Vacuum/Air Spraying
Backing tubes: ID56 x OD64 x Length300~3000mm, Thickness: 3~5mm
Backing tubes: ID78~83 x OD89~92 x Length300~3000mm, Thickness: 3~7mm
Backing tubes: ID100 x OD108 x Length300~3000mm, Thickness: 3~8mm
Backing tubes: ID125 x OD133 x Length300~4000mm, Thickness: 3~13mm
Bonding
Backing tubes: ID125 x OD133 x Length500~4000mm, Thickness: 8~13mm
* Maximum sizes of planar target
Thickness: 30mm (can be 60mm for round target)
Width: max 2000mm
Length: max 4000mm
* Maximum sizes of rotary target
Vacuum/Air Spraying
Backing tubes: ID56 x OD64 x Length300~3000mm, Thickness: 3~5mm
Backing tubes: ID78~83 x OD89~92 x Length300~3000mm, Thickness: 3~7mm
Backing tubes: ID100 x OD108 x Length300~3000mm, Thickness: 3~8mm
Backing tubes: ID125 x OD133 x Length300~4000mm, Thickness: 3~13mm
Bonding
Backing tubes: ID125 x OD133 x Length500~4000mm, Thickness: 8~13mm
Metal sputtering targets are materials extensively utilized in modern industry. They are primarily employed in the sputtering process for thin film deposition across various industries, including semiconductor, electronics, optics, and surface coating. It is a method of transforming a solid material into a liquid or gaseous state and accelerating it to the target surface using physical vapor deposition techniques. It uses ions produced by an ion source to gather at an accelerated rate in a vacuum, forming a high- speed ion beam that bombards a solid surface. The ions exchange kinetic energy with the solid surface atoms, causing the solid surface atoms to leave the solid and deposit on the base surface.If you need any information or a quote please contact us, you can contact our sales team directly or fill out the form below and we will get back to you in time.
