Sputtering target for thin film deposition

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Sputtering Target for Thin Film Deposition

Sputtering is a physical vapor deposition (PVD) process where atoms are ejected from the surface of a material when it is bombarded by high-energy particles. In sputtering deposition, a controlled gas, typically inert argon, is introduced into a vacuum chamber. A cathode is then electrically energized to create a self-sustaining plasma. The surface of the cathode that is exposed is known as the sputtering target.

Sputtering targets are usually solid pieces that come in various sizes and shapes. These targets can be made from pure metals, alloys, or compounds such as oxides or nitrides. The substrate, which is the object to be coated, can be a semiconductor wafer, a solar cell, an optical component, or many other types of materials. The thickness of the coatings typically ranges from angstroms to microns. The thin film can consist of a single material or multiple materials in a layered structure.