Thermal Bonding Machine
Coreal Tech provides advanced thermal bonding machines for semiconductor packaging, thermo-compression bonding, flip chip assembly, and high-precision IC packaging applications. Our systems deliver accurate temperature control, stable bonding pressure, and high alignment precision for advanced semiconductor manufacturing.
Integrating chip preheating and thermal bonding functions in one unit, the equipment achieves high-precision chip mounting under high-precision visual guidance by virtue of closed-loop pressure control technology. It can be connected to the MES (Manufacturing Execution System) for online recipe management, effectively controlling the overall production efficiency. Suitable for high-precision chip bonding in optical modules, AR glasses, sensors and other industries.
Technical Specifications
Equipment dimensions
1430× 1640× 1750mm
Equipment weight
1900kg
Chip size
1× 1mm – 18× 18mm; Thickness: 50- 200μm
Positioning accuracy
±10μm
Production cycle
2S/c
What Is a Thermal Bonding Machine?
A thermal bonding machine is specialized semiconductor packaging equipment used to create reliable electrical and mechanical interconnections between semiconductor dies, substrates, wafers, and electronic components through controlled heat and pressure.
Thermal bonding technology is widely used in advanced semiconductor packaging processes including:
Thermo-Compression Bonding (TCB)
Flip Chip Packaging
Wafer-Level Packaging
2.5D/3D IC Packaging
Heterogeneous Integration
Chip-to-Substrate Bonding
As semiconductor devices continue toward smaller nodes and higher integration density, thermal bonding technology has become increasingly important for achieving ultra-fine pitch interconnects and high-reliability packaging.
If you would like more information about this product, please feel free to contact us.
