FPC circuit board laser processing equipment
1. Strong compatibility: can cut/drill/mark, reduce procurement costs, save plant space;2. Zero consumables: non-contact laser process, zero tool loss;3. Second-level line change: hundreds of sets of processes are stored in advance, and the order switching time is less than 1 minute;4. Invisible loss reduction: heat-affected zone ≤10μm, providing material utilization improvement;FPC board laser processing equipment is specially designed for high-precision processing of flexible circuit boards. It integrates three-in-one functions of laser cutting, drilling and marking. It adopts non-contact ultrafast laser technology to achieve micron-level processing accuracy (line width ≤15μm), heat-affected zone ≤10μm, and eliminates material deformation and carbonization. Equipped with intelligent process library and visual positioning, it supports the switching of complex graphics from micro-holes to multi-layer blind grooves in seconds, and adapts to the efficient production of fragmented orders.
Highlights1. No need to open molds, process according to drawings, and form in one go2. Cut without black edges or burrs3. Use visual alignment to achieve high-precision cutting4. No tool consumables, low operating costs
Microtreat supply high-precision, fast, and durable laser scribing machines for solar cells, semiconductors, electronics, and glass processing. Our customizable systems improve production efficiency and quality, backed by reliable support. Contact us for solutions and pricing.
