Laser wafer marking equipment
Equipment Functions: This Laser wafer marking equipment utilizes high-precision UV laser cold processing technology, specifically designed for efficient marking of semiconductor wafers. Equipped with an intelligent vision positioning and automated control system, it can permanently and precisely mark various wafers, including silicon, SiC, and GaN, with features such as QR codes, serial numbers, wafer IDs, and anti-counterfeiting markings. The markings are highly clear, easily recognizable, and durable.
The processing is free from mechanical stress, thermal damage, and contamination, ensuring wafer integrity and device performance, meeting the traceability requirements of automotive-grade, high-reliability chips. The equipment operates stably and is highly adaptable, seamlessly integrating with automated production lines to provideefficient, precise, and reliable marking solutions for semiconductor manufacturing.
Microtreat is a trusted film cutting machine manufacturer with 15+ years of R&D experience, serving global clients in electronics, medical, and automotive industries. Our ISO-certified factory delivers reliable, high-performance machines with lifetime technical support.
